As semiconductor technology advances into increasingly smaller process nodes, engineering organizations are managing unprecedented design complexity. Multi-terabyte SoC designs, globally distributed engineering teams, and compressed product schedules are placing significant pressure on traditional design data management solutions.
The Next-Generation DesignSync User Meeting 2026 brings together semiconductor and engineering professionals to explore what’s driving that acceleration and what it takes to stay ahead.
Join us for an immersive day where we share experiences and address questions that matter most to semiconductor engineering teams, including:
- How can I improve engineering productivity for extremely large semiconductor designs?
- How can I accelerate synchronization of design assets across globally distributed teams?
- How can I reduce delays during design integration and manufacturing handoff?
- How can I maintain business continuity while evolving to a next-gen, scalable platform capable of supporting future generations of semiconductor designs?
You’ll hear directly from professional peers and our team of experts, participate in interactive discussions, experience live demonstrations and explore deployment options that fit your organization’s environment.
Whether you’re evaluating solutions, deepening your current deployment or preparing for what’s next, this is where you’ll find the expertise, the conversations and the clarity to move forward with confidence.