To stay ahead of competition by better managing speed of innovation, technology complexity, global regulatory challenges and value chain volatility, high-tech innovators are looking for new, breakthrough ways to empower their engineering teams and leverage digital transformation to connect their entire value network.
Discover 3DEXPERIENCE™ delivering market leading software solutions and best practices to propel the collaborative innovation of electronics systems and components:
- Explore best practices to enable continuous innovation, leveraging model based systems engineering (MBSE), integrated modelling & simulation (MODSIM) and Data- and Artificial Intelligence.
- Increase your agility to address sustainability challenges, global demand, sovereignty pressure, and unpredictable value chain dynamics by leveraging Virtual Twin technology for product and process engineering.
- Empower your teams with advanced solutions on-premise and on-the-cloud, that simplify and accelerate the collaborative creation of complex electronics systems; from semiconductors and embedded systems to test and measurement equipment and latest generation wireless systems.
- Learn from innovative projects and market leaders how you can leverage Virtual Twin Experiences to empower your new partnerships and propel novel business models. Also, discover how Dassault Systèmes’ AI technology can expedite and enhance your innovation.
Mark Your Calendar:
Join us at this world-leading trade fair in Munich, November 12-15, 2024.